110W device, 25°C ambient, 125°C max
Inputs
Result
θsa = (125-25)/10 - 1.5 - 0.5 = 10 - 2 = 8.0°C/W.
Required Heat Sink
8.00 °C/W
Tj
125.0°C
Margin
0.0°C
From device datasheet (typically 0.5–5 °C/W)
Thermal pad: 0.2–1 °C/W
Enter to compute actual Tj with your chosen heat sink
Required θsa (Sink to Ambient)
8.00 °C/W
Junction Temp
125.0°C
Case Temp
110.0°C
Margin
0.0°C
Total θ
10.00
Inputs
Result
θsa = (125-25)/10 - 1.5 - 0.5 = 10 - 2 = 8.0°C/W.
Inputs
Result
θsa = (150-40)/25 - 0.5 - 0.3 = 4.4 - 0.8 = 3.6°C/W.
θsa = (Tj_max - Ta)/P - θjc - θcs. For 10W, 25°C ambient, 125°C max junction, θjc=1.5, θcs=0.5: θsa = (125-25)/10 - 1.5 - 0.5 = 8.0°C/W.
| Power (W) | Ambient | Max Tj | Required θsa |
|---|---|---|---|
| 5W | 25°C | 125°C | 18.0 °C/W |
| 10W | 25°C | 125°C | 8.0 °C/W |
| 20W | 25°C | 125°C | 3.0 °C/W |
| 50W | 40°C | 150°C | 0.2 °C/W |
θjc is the thermal resistance from the semiconductor junction to the outside of the package. It's fixed by the IC design and listed in the datasheet. Typical: TO-220 = 1-3°C/W, TO-92 = 80-150°C/W.
θcs depends on the thermal interface between IC and heat sink. Thermal grease: 0.2–0.5°C/W. Thermal pad: 0.5–1.0°C/W. Dry contact: 1–2°C/W.
A negative θsa means no heat sink can keep the junction below Tj_max. Solutions: reduce power, improve airflow, use a lower θjc package, or increase acceptable Tj.
Electronics, outdoor, and everyday tools
Last Updated: Mar 21, 2026
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